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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Jiun-Hong Lai Cooper, I.B. Xudong Chen Church, K. Haixin Yang Rohatg, A. |
| Copyright Year | 2012 |
| Description | Author affiliation: Regent's Professor, Georgia Institute of Technology, USA (Rohatg, A.) || nScrypt Inc, 12151 Research Pkwy, suite 150, Orlando, Florida, 32826, USA (Xudong Chen; Church, K.) || University Center of Excellence for Photovoltaics, Georgia Institute of Technology, Atlanta, 30332 USA (Jiun-Hong Lai; Cooper, I.B.) || DuPont Microcircuit Materials, 14 T. W. Alexander Drive, Research Triangle Park, NC 27709, USA (Haixin Yang) |
| Abstract | This paper presents the use of a finer line printing technology for achieving over 20.2% efficient cells with oxide/nitride rear passivation and screen-printed local back contacts on large-area (239 $cm^{2})$ commercial grade Cz Si wafers. The front metal gridlines are printed by a one-step non-contact approach of a modified silver printable paste. The line width is as narrow as 55µm, and the line height is more than 35µm after firing in a conventional belt furnace. The significantly reduced metal converge on the front side resulted in reduced shadowing loss and an increase in absolute cell efficiency of ∼0.5% compared to the screen-printed reference solar cells. Increasing the number of gridlines from 74 to 83 in conjunction with reduced line width from 100 µm to 55 µm increased the J by ∼0.5 $mA/cm^{2}$ to 38.4 $mA/cm^{2}.$ This combined with a V of 657 mV and FF of 80.0% produced the 20.2% efficient cell compared to a 19.7% screen-printed cell. |
| Starting Page | 002192 |
| Ending Page | 002195 |
| File Size | 341120 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781467300643 |
| ISSN | 01608371 |
| e-ISBN | 9781467300667 |
| DOI | 10.1109/PVSC.2012.6318031 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2012-06-03 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Artificial intelligence Printing Abstracts Silicon compounds Heating Annealing Microscopy |
| Content Type | Text |
| Resource Type | Article |
| Subject | Industrial and Manufacturing Engineering Control and Systems Engineering Electrical and Electronic Engineering |
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