NDLI: Transparent conductive oxide / encapsulant interface characterization following Damp Heat exposure

Content Provider	IEEE Xplore Digital Library
Author	Stika, K.M. Pelisset, S. Schreiber, S. de Borman Chautems, F. Dafniotis, P. Perret-Aebi, L.-E. Ballif, C.
Copyright Year	2012
Description	Author affiliation: E.I. DuPont de Nemours & Co. 200 Powder Mill Road, Wilmington, DE, 19880-0323, United States (Stika, K.M.) \|\| Ecole Polytechnique Fédérale de Lausanne (EPFL), Institute of Microengineering (IMT), Photovoltaics and Thin Film Electronics Laboratory, Rue A.-L. Breguet 2, CH-2000 Neuchâtel, Switzerland (Pelisset, S.; Perret-Aebi, L.-E.; Ballif, C.) \|\| DuPont de Nemours International Sàrl, European Technical Centre, Route du Nant d'Avril 146, CH-1217, Meyrin, Genève, Switzerland (Schreiber, S.; de Borman Chautems, F.; Dafniotis, P.)
Abstract	The role of surface analysis, specifically XPS (X-ray Photoelectron Spectroscopy) and SIMS (Secondary Ion Mass Spectrometry) has been explored to broaden our understanding of TCO / encapsulant interactions focusing on TCO resistivity evolution. Peel laminates of PVB, Ionomer and EVA encapsulants with LPCVD boron doped ZnO were exposed to Damp Heat and removed at different points in the aging cycle for analysis. Distinct response patterns were observed for the different encapsulant families and selected ionomers were found to be most effective at protecting and maintaining the conductivity of the TCO. Trends in interfacial ion enrichment as a function of damp heat exposure were determined by a combination of XPS and SIMS to provide the necessary quantitation, sensitivity and surface specificity. In this study, the transition from a cohesive peel within the encapsulant toward an adhesive peel between the TCO and encapsulant layers provided an important point of comparison. Depth profiling to determine the distribution of mobile species throughout the thickness of the TCO added yet another dimension to our understanding of TCO / encapsulant interactions.
Starting Page	000470
Ending Page	000473
File Size	981697
Page Count	4
File Format	PDF
ISBN	9781467300643
ISSN	01608371
e-ISBN	9781467300667
DOI	10.1109/PVSC.2012.6317659
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-06-03
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Glass Laminates Substrates Heating Polymers Conductivity Films polymers Conductive films encapsulation photovoltaic systems
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Control and Systems Engineering Electrical and Electronic Engineering

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