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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Van Nieuwenhuysen, K. Gordon, I. Bearda, T. Boulord, C. Debucquoy, M. Depauw, V. Dross, F. Govaerts, J. Granata, S. Labie, R. Loozen, X. Martini, R. O'Sullivan, B. Radhakrishnan, H.S. Baert, K. Poortmans, J. |
| Copyright Year | 2012 |
| Description | Author affiliation: Dow Corning, Rue Jules Bordet C, B-7180 Seneffe, Belgium (Boulord, C.) || Imec, Kapeldreef 75, B-3001 Leuven, Belgium (Van Nieuwenhuysen, K.; Gordon, I.; Bearda, T.; Debucquoy, M.; Depauw, V.; Dross, F.; Govaerts, J.; Granata, S.; Labie, R.; Loozen, X.; Martini, R.; O'Sullivan, B.; Radhakrishnan, H.S.; Baert, K.; Poortmans, J.) |
| Abstract | Foil creation by lifting off a thin layer of a high quality silicon substrate is one of the promising substitutes for wafer sawing to create substrates thinner than 100 µm. The porous silicon-based layer transfer process is a well known method to obtain high quality foils. Despite a number of convincing lab-based solar cell show-cases, there is no breakthrough of this technology at (semi)-industrial level, because of the poor yield of processing free standing foils. This paper presents a method to fabricate back contacted solar cells based on epitaxial foils avoiding processes on free-standing foils. First, a porous silicon layer is electrochemically etched, acting as a weak sacrificial layer to detach the foil that is epitaxially grown on top of the porous silicon layer. Characterization of the epitaxial foils shows a good crystalline quality and an effective lifetime around 100 µs. Those results give indications that the obtained foils are well suited for solar cell fabrication. Front-side processing is done while the epitaxial foil is still attached to its parent substrate. A good yield is obtained for epitaxial foils that underwent the front-side processing sequence consisting of wet chemical texturing, FSF formation, passivation and ARC deposition. Afterwards, the front-side of the foil is bonded to a glass carrier and the foil is detached from its parent substrate. Silicone adhesives are used for this permanent bond. The rear-side of the solar cell is processed while bonded to glass. Therefore, only low temperature processes (<200°C) can be used. So far, the rear-side processing sequence was performed on Float-zone reference wafers as a proof of concept resulting in a confirmed maximum efficiency of 18.4%. The rear-side processing sequence still needs to be applied on epitaxial foils |
| Starting Page | 001833 |
| Ending Page | 001836 |
| File Size | 1011335 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781467300643 |
| ISSN | 01608371 |
| e-ISBN | 9781467300667 |
| DOI | 10.1109/PVSC.2012.6317950 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2012-06-03 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Epitaxial growth Glass Fabrication Packaging Layer transfer Solar cell Silicon Epitaxy Thin foil Porosification |
| Content Type | Text |
| Resource Type | Article |
| Subject | Industrial and Manufacturing Engineering Control and Systems Engineering Electrical and Electronic Engineering |
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