NDLI: Grain boundary recobination activity in Cu(In,Ga)Se solar cells with ion-polished flat surface

Content Provider	IEEE Xplore Digital Library
Author	Minemoto, T. Wakisaka, Y. Takakura, H.
Copyright Year	2010
Description	Author affiliation: Ritsumeikan University, Ritsumeikan Global Innovation Research Organization, 1-1-1 Nojihigashi, Kusatsu, Shiga, Japan (Minemoto, T.; Takakura, H.) \|\| Ritsumeikan University, College of Science and Engineering, 1-1-1 Nojihigashi, Kusatsu, Shiga, Japan (Wakisaka, Y.)
Abstract	Grain boundaries should not act as effective recombination centers in high efficiency polycrystalline Cu(In,Ga)Se (CIGS) solar cells. In this study, a CIGS surface was ion-polished to make a flat surface, which eliminates the influence of surface features in electron-beam-induced-current (EBIC) measurement. Solar cells using the CIGS films with and without the ion polishing showed almost similar efficiency. This indicates that the ion polishing did not cause a serious damage on the surface or the damage was eliminated during the solar cell fabrication process. The solar cell without the ion polishing showed lower EBIC signals at grain boundaries, meaning that the EBIC image was influenced by the surface feature. In contrast, the EBIC image for the solar cell with the ion polishing hardly showed the surface feature. The result indicates that there was no distinct difference between the recombination at intra grains and grain boundaries.
Starting Page	003456
Ending Page	003459
File Size	1387162
Page Count	4
File Format	PDF
ISBN	9781424458905
ISSN	01608371
e-ISBN	9781424458929
DOI	10.1109/PVSC.2010.5614672
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-06-20
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Photovoltaic cells Grain boundaries Films Surface cleaning Spontaneous emission Voltage measurement
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Control and Systems Engineering Electrical and Electronic Engineering

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