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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Chih-Hsien Lin Wei-Lin Chen Chen-Hsun Du Chi-Chao Wan Yung-Yun Wang |
| Copyright Year | 2010 |
| Description | Author affiliation: Department of Materials Science, National Tsing Hua University, Hsinchu, Taiwan R.O.C. (Wei-Lin Chen) || Department of Chemical engineering, National Tsing Hua University, Hsinchu, Taiwan R.O.C. (Chih-Hsien Lin; Chi-Chao Wan; Yung-Yun Wang) || Photovoltaics Technology Center, Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan R.O.C. (Chen-Hsun Du) |
| Abstract | This work presents a novel and low-cost printing technique to construct a three-layer (Pd/Ni/Cu) structure as front side conductor of textured mono-crystalline silicon solar cells. The technique involves microcontact printing and electrochemical deposition. Electrochemical deposition including electroless Ni and electroplated Cu offers an inexpensive method in contrast to the conventional silver-paste. The first step of this technique is activation by Pd nanoparticles. The Pd nanoparticles with average particle size about 2.65 nm are then mixed with organic solvent to prepare Pd ink. Then we imprint Pd ink on the front side of solar cell by microcontact printing, which can print fine-lines of less than 60 µm width. The second layer is electroless nickel providing low contact resistance and good mechanical adhesion. The third layer is electrodeposited Cu to increase the line conductivity. X-ray diffraction (XRD) technique and secondary electron microscopy (SEM) were employed to detect the presence of nickel-silicides phase after annealing. This new scheme has proven to be workable and may become an alternative approach for surface metallization on solar cell. |
| Starting Page | 001330 |
| Ending Page | 001334 |
| File Size | 1813763 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781424458905 |
| ISSN | 01608371 |
| e-ISBN | 9781424458929 |
| DOI | 10.1109/PVSC.2010.5614354 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2010-06-20 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Annealing Nickel Films Solar power generation Asia Silicon Resistance |
| Content Type | Text |
| Resource Type | Article |
| Subject | Industrial and Manufacturing Engineering Control and Systems Engineering Electrical and Electronic Engineering |
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