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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Tong Boon Tang Murray, A.F. Binjie Cheng Asenov, A. |
| Copyright Year | 2010 |
| Description | Author affiliation: Dept. of Electronics and Electrical Eng., University of Glasgow, Glasgow G12 8LT, United Kingdom (Binjie Cheng; Asenov, A.) || School of Engineering University of Edinburgh Edinburgh EH9 3JL, United Kingdom (Tong Boon Tang; Murray, A.F.) |
| Abstract | Static statistical variability and time-dependent reliability are traditionally analyzed separately. This paper presents a new methodology which combines both types of variability within a single circuit analysis framework. A comprehensive Negative Bias Temperature Instability (NBTI) model was implemented. Effects of random discrete dopants, line edge roughness and poly-Silicon granularity were considered. Using a 74X-series benchmark circuit (4-bit fast-carry adder) as an example, the concept of integrating both static statistical variability and time-dependent reliability into circuit analysis is demonstrated. |
| Starting Page | 2494 |
| Ending Page | 2497 |
| File Size | 600625 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781424453085 |
| DOI | 10.1109/ISCAS.2010.5537132 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2010-05-30 |
| Publisher Place | France |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Ultra large scale integration Niobium compounds Titanium compounds Degradation Hydrogen Circuit analysis MOSFET circuits Semiconductor process modeling Stress Circuits and systems |
| Content Type | Text |
| Resource Type | Article |
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