NDLI: Temperature and power measurement of modern dual core processor by infrared thermography

Content Provider	IEEE Xplore Digital Library
Author	Farkhani, F.F. Mohammadi, F.A.
Copyright Year	2010
Description	Author affiliation: Department of Electrical and Computer Engineering, Ryerson University, 350 Victoria Street, M5B 2K3, Toronto, Ontario, Canada (Farkhani, F.F.; Mohammadi, F.A.)
Abstract	An infrared (IR) thermography measurement setup to capture the temperature distribution and power dissipation of the device under test is proposed in this paper. The system is based on a transparent oil heatsink which captures the thermal profile and run-time power dissipation from the device under test with a very fine degree of granularity. The proposed setup is used to perform the thermal analysis and power dissipation measurement of an Intel Dual Core E2180 processor. In addition, a three-dimensional finite element thermal model of the processor is developed to simulate the thermal properties of the processor. The results obtained using simulation efforts are compared to the experimental results from IR thermography.
Starting Page	1603
Ending Page	1606
File Size	793840
Page Count	4
File Format	PDF
ISBN	9781424453085
DOI	10.1109/ISCAS.2010.5537442
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-05-30
Publisher Place	France
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Temperature measurement Power measurement Power dissipation Temperature distribution Petroleum Runtime System testing Performance evaluation Performance analysis Finite element methods
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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