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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Jin Yin Li Guangming He Wen-Zhi |
| Copyright Year | 2010 |
| Abstract | With the production of electrical and electronic equipment (EEE) being one of the fastest growing markets in the world, the steep increasing amount of waste electrical and electronic equipment (WEEE) has triggered off a serious environmental crisis. A composite plate produced by using nonmetallic materials of pulverized waste printed circuit boards(PCBs) obtained after air classification as filler was prepared. The main mechanical properties of composite plate such as tensile strength, bending and impact strength were compared according to different filler particle size, dosage, and modifier and the inner structure of the composite plate was investigated by fractography study. The results indicated that using polypropylene S700 as the base resin and maleic anhydride grafted polypropylene (MAH-g-PP) as a modifier, the mechanical properties of composite plate were excellent when non-metallic materials with particle size from 0.125 to 0.3mm adding amount was 20 wt%. This technique of recycling waste PCBs offers a new way for the improvement of recovery and treatment system of WEEE and possesses wide application prospects. |
| Starting Page | 1 |
| Ending Page | 4 |
| File Size | 707812 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781424447121 |
| ISSN | 21517622 |
| DOI | 10.1109/ICBBE.2010.5516729 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2010-06-18 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Waste materials Powders Electronic equipment Composite materials Printed circuits Production Electronic waste Mechanical factors Recycling Resins |
| Content Type | Text |
| Resource Type | Article |
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