NDLI: Laser-micromachined, chip-scaled ceramic carriers for implantable neurostimulators

Content Provider	IEEE Xplore Digital Library
Author	Guenther, Thomas Mintri, Apoorv Lim, William W. Jung, Louis H. Lehmann, Torsten Lovell, Nigel H. Suaning, Gregg J.
Copyright Year	2011
Description	Author affiliation: Faculty of Engineering, School of Electrical Engineering and Telecommunications, The University of New South Wales, Kensington, NSW, 2052, Australia (Lehmann, Torsten) \|\| Faculty of Engineering, Graduate School of Biomedical Engineering, The University of New South Wales, Kensington, NSW, 2052, Australia (Guenther, Thomas; Mintri, Apoorv; Lim, William W.; Jung, Louis H.; Lovell, Nigel H.; Suaning, Gregg J.)
Abstract	Hermetic encapsulation of long-term implantable devices using ceramics has been investigated over several decades. Our studies focus on the miniaturization of ceramic encapsulations for large numbers of stimulation channels. Laser-patterning of screen printed platinum (Pt) paste on cofired ceramics has been shown to enable the construction of features comparable in size to classical screen printing. A novel technique for embedding Pt structures into the surface of Al2O3 substrates is shown to produce features with a line width minimum of 20 μm and a pitch of 40 μm. Polishing the ceramic substrates enables flip-chip bonding of application specific integrated circuits (ASIC) using gold stud bumps. A new technique for fine tuning of an ASIC stimulator with stud bump bridges is described. The technique eliminates the need for wire bond loops and increases reliability and integration density of the system, which are major requirements used to construct a visual prosthesis or other implantable devices requiring miniaturization. The methods for laser-patterned Pt tracks in alumina for fine pitch structures are described. Feasibility studies for flip-chip bonding and stud bump bridges were undertaken and the results were found to be promising.
Starting Page	1085
Ending Page	1088
File Size	1298732
Page Count	4
File Format	PDF
ISBN	9781424441211
ISSN	1557170X
e-ISBN	9781457715891
e-ISBN	9781424441228
DOI	10.1109/IEMBS.2011.6090253
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-08-30
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Substrates Application specific integrated circuits Ceramics Bonding Lasers Gold Wires
Content Type	Text
Resource Type	Article
Subject	Signal Processing Biomedical Engineering Health Informatics Computer Vision and Pattern Recognition

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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