NDLI: The influence of SO2 environments on immersion silver finished PCBs by mixed flow gas testing

Content Provider	IEEE Xplore Digital Library
Author	Shunong Zhang Shrivastava, A. Osterman, M. Pecht, M. Rui Kang
Copyright Year	2009
Description	Author affiliation: CALCE Center for Advanced Life Cycle Engineering University of Maryland College Park, MD-20742, U.S.A (Shrivastava, A.; Osterman, M.; Pecht, M.) \|\| Dept. of System Engineering of Engineering Technology Beijing University of Aeronautics and Astronautics Beijing, 100191, P. R. China (Shunong Zhang; Rui Kang)
Abstract	This study focuses on the corrosion of immersion silver (ImAg) finished copper land patterns on printed circuit boards (PCBs) due to SO2 exposure in a mixed flow gas chamber. Six test conditions were examined with varying concentrations, temperatures, relative humidity, and exposure times. The results indicated that there are two mechanisms of corrosion on ImAg-finished PCBs in an SO2 gas environment: direct chemical corrosion and electrode reaction. No evidence shows that Ag2S and Cu2S or CuS were produced. In high humidity, chemical and electrode reaction both existed, and the corrosion products could included Ag2O, AgCl, Ag2SO3, CuO, CuCl2 and CuCl, In low humidity, the chemical corrosion was predominant, and the corrosion products could include Ag2O, CuO. Passive films were formed on ImAg finished surface under long exposure time. The temperature from 30°C to 40°C did not have an obvious influence on the ImAg-finished PCBs.
Starting Page	116
Ending Page	122
File Size	1668456
Page Count	7
File Format	PDF
ISBN	9781424446582
DOI	10.1109/ICEPT.2009.5270782
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-08-10
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Corrosion Humidity Copper Electrodes Chemical products Silver Printed circuits Circuit testing Land surface temperature Surface finishing
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

The Influence of $hbox{H}_{2}hbox{S}$ Exposure on Immersion-Silver-Finished PCBs Under Mixed-Flow Gas Testing

Reliability assessment of immersion silver finished circuit board assemblies using clay tests

A method of reliability assessment on creep corrosion for immersion silver finished PCBs

Corrosion of ImAg-Finished PCBs Subjected to Elemental Sulfur Environments

Investigation on Mechanism of Creep Corrosion of Immersion Silver Finished Printed Circuit Board by Clay Tests

The influence of temperature and humidity on the wettability of immersion tin coated printed wiring boards

Insulation Reliability Of Fine Pitch Copper Paste Filled Via Holes

Surface roughness influence on solderability

Influence of special cleaning compounds on PCBs solderability

The influence of SO2 environments on immersion silver finished PCBs by mixed flow gas testing

Similar Documents

The Influence of $hbox{H}_{2}hbox{S}$ Exposure on Immersion-Silver-Finished PCBs Under Mixed-Flow Gas Testing

Reliability assessment of immersion silver finished circuit board assemblies using clay tests

A method of reliability assessment on creep corrosion for immersion silver finished PCBs

Corrosion of ImAg-Finished PCBs Subjected to Elemental Sulfur Environments

Investigation on Mechanism of Creep Corrosion of Immersion Silver Finished Printed Circuit Board by Clay Tests

The influence of temperature and humidity on the wettability of immersion tin coated printed wiring boards

Insulation Reliability Of Fine Pitch Copper Paste Filled Via Holes

Surface roughness influence on solderability

Influence of special cleaning compounds on PCBs solderability

The influence of SO2 environments on immersion silver finished PCBs by mixed flow gas testing