NDLI: Reliability assessment of immersion silver finished circuit board assemblies using clay tests

Content Provider	IEEE Xplore Digital Library
Author	Yilin Zhou Pecht, M.
Copyright Year	2009
Description	Author affiliation: CALCE Electronic Products and Systems Center University of Maryland College Park, 20742, USA (Pecht, M.) \|\| Research Lab of Electric Contacts, Automation School Beijing University of Posts and Telecommunications Beijing, 100876, China (Yilin Zhou)
Abstract	This paper discusses issues regarding the reliability of immersion silver (ImAg) surface finish on printed circuit boards (PCBs) in high-sulfur environments with a focus on creep corrosion. The test approach used clay with sulfur to drive corrosion. It was found that silver sulfide had formed on the ImAg surfaces, but dendrite-shaped creep corrosion products were formed on the edges of the ImAg finished copper traces by galvanic corrosion. The creep distance and the content of CuS and Ag2S in the corrosion products were dependent on the relative location of the pad edges and the solder mask, which caused different extents of coverage of ImAg finish on the copper traces. A Weibull distribution with two parameters was used to analyze the length of the creep corrosion products, the values of which were used along with corrosion probability to assess the corrosion resistance of ImAg finished PCBs.
Starting Page	1212
Ending Page	1216
File Size	1389628
Page Count	5
File Format	PDF
ISBN	9781424449033
DOI	10.1109/ICRMS.2009.5270038
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-07-20
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Creep Printed circuits creep corrosion immersion silver Circuit testing Surface finishing Silver Corrosion sulfur Copper Weibull distribution Galvanizing Assembly
Content Type	Text
Resource Type	Article

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