NDLI: Adhesion behavior between epoxy molding compound and different leadframes in plastic packaging

Content Provider	IEEE Xplore Digital Library
Author	Li Xu Xiuzhen Lu Johan Liu Xinyu Du Yan Zhang Zhaonian Cheng
Copyright Year	2009
Description	Author affiliation: Key Laboratory of Advanced Display and System Applications, Ministry of Education and SMIT Center, School of Mechatronics Engineering and Automation, Shanghai University, Shanghai 200072, China (Li Xu; Xiuzhen Lu; Johan Liu; Yan Zhang) \|\| Henkel Corporation, 15350 Barranca Pkwy, Irvine CA 92618, USA (Xinyu Du) \|\| SMIT Center & Bionano Systems Laboratory, Department of Microtechnology and Nanoscience, Chalmers University of Technology, SE-412 96 Gothenburg, Sweden (Zhaonian Cheng)
Abstract	Adhesion has been identified as one of the key elements in solving failure problems in electronic packaging. Understanding and improving the adhesion between epoxy molding compound (EMC) and leadframes is thought to be a key step towards improving package performance. The objective of this work was to study the effect on adhesion behavior and delamination of plastic packages using various metal coated leadframes that had been subjected to preconditions. In this work, the effects of moisture absorption testing and reflow process on the interface adhesion strength of the EMC/metal leadframes were studied. Three kinds of metal coated leadframes were used: copper, silver coated copper and nickel/palladium/gold coated copper. Adhesion strength was measured using the tab pull test. These data were correlated to some extent with the findings of package delamination observed by the C-mode Scanning Acoustic Microscope (C-SAM). Scanning Electron Microscopy (SEM) and Energy Dispersive Spectroscopy (EDS) were employed to characterize the surface of EMC and metal leadframes after separation along the vertical plane.
Starting Page	1039
Ending Page	1042
File Size	2889078
Page Count	4
File Format	PDF
ISBN	9781424446582
DOI	10.1109/ICEPT.2009.5270581
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-08-10
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Adhesives Lead compounds Plastic packaging Electronics packaging Electromagnetic compatibility Copper Scanning electron microscopy Delamination Moisture Absorption
Content Type	Text
Resource Type	Article

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