NDLI: Characterize the microstructure and reliability of ultra fine pitch BGA joints

Content Provider	IEEE Xplore Digital Library
Author	Lei Wang Zhenqing Zhao Qian Wang Jaisung Lee
Copyright Year	2009
Description	Author affiliation: Samsung Semiconductor China R&D Co., Ltd. No. 15, Jin Ji Hu Road, Suzhou Industrial Park, Suzhou, China 215021 (Lei Wang; Zhenqing Zhao; Qian Wang; Jaisung Lee)
Abstract	The solder ball pitch of BGA packages in mass production now is normally above 0.5mm. To fulfill the future demand of package miniaturization, the 0.4mm ultra fine pitch BGA solder joint was researched in this paper. The solder volume shrinkage along with the ball pitch decrease was found to affect the joint microstructure, which could be characterized in two aspects: the Sn dendrites in bulk solder became finer, and the so called “cross-interaction” in interfacial layer occurred. The joint reliability variation due to volume shrinkage was paid much attention to. Four different alloy content solder balls were evaluated through thermal cycling and drop reliability test, to find out the most proper soldering materials on both NiAu and OSP pad finishes. Our research result indicated that reliable ultra fine pitch joint could be gotten if proper materials and processes adopted. Sn1.0Ag0.5Cu0.02Ni was recommended as the solder alloy composition for the ultra fine pitch BGA usage.
Starting Page	674
Ending Page	678
File Size	1277390
Page Count	5
File Format	PDF
ISBN	9781424446582
DOI	10.1109/ICEPT.2009.5270663
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-08-10
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Microstructure Soldering Materials reliability Materials testing Packaging Mass production Joining materials Protection Cleaning Optical microscopy
Content Type	Text
Resource Type	Article

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