NDLI: The fabrication of composite solder by addition of copper nano powder into Sn-3.5Ag solder

Content Provider	IEEE Xplore Digital Library
Author	Nadia, A.
Copyright Year	2009
Description	Author affiliation: University Malaya Mech Engineering, University Malaya, 50603 KL, Malaysia (Nadia, A.)
Abstract	Copper nano powder was incorporated into Sn-3.5Ag solder at 3wt%, by mechanically alloyed (MA) by ball milling in a planetary ball mill at room temperature. The rotation speed was kept constant at 150 rpm with different milling time, 26 hours, 78 hours and 120 hours. The milled solder was mixed with flux and reflowed at 240°C for 60 seconds. XRD result confirmed the formation of Cu3Sn after 120 hours of milling time. The melting temperature of the samples decreased as a function of milling time. The wetting angle was improved by 48% for the composite solder Sn-3.5Ag-nano-3.0Cu for 120 hours ball milled, compared to the Sn3.5Ag solder. Increased of hardness was obtained as a result of incorporation of nanoparticle.
Starting Page	607
Ending Page	610
File Size	1831224
Page Count	4
File Format	PDF
ISBN	9781424446582
DOI	10.1109/ICEPT.2009.5270678
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-08-10
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Fabrication Copper Powders Ball milling Lead Environmentally friendly manufacturing techniques Alloying Scanning electron microscopy Extraterrestrial measurements Testing
Content Type	Text
Resource Type	Article

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The fabrication of composite solder by addition of copper nano powder into Sn-3.5Ag solder