NDLI: Study of isothermal bending fatigue test

Content Provider	IEEE Xplore Digital Library
Author	Minyi Lou Long Wen Zhengrong Chen Jianwei Zhou Qian Wang Jaisung Lee
Copyright Year	2009
Description	Author affiliation: Samsung Semiconductor (China) R&D Co., Ltd No. 15, Jin Ji Hu Road, Suzhou Industrial Park, Suzhou, China (Minyi Lou; Long Wen; Zhengrong Chen; Jianwei Zhou; Qian Wang; Jaisung Lee)
Abstract	TC test is very important for solder joint reliability, but the test time for TC test is very long, normally it cost about 2 months. In order to shorten TC test time, many researchers study the new test method to replace traditional TC test, such as bending fatigue test. However, there's still some limit for this field study. Considering the actual user condition, the final product not only experience mechanical loading, but also thermal loading. Therefore, isothermal bending test (−25°C, 25°C, 75°C, 125°C) were studied to research the relationship of lifetime and failure mechanism between TC test and bending fatigue test. ANSYS was used to simulate isothermal bending fatigue test and also compare with traditional TC test.
Starting Page	1246
Ending Page	1255
File Size	2628529
Page Count	10
File Format	PDF
ISBN	9781424446582
DOI	10.1109/ICEPT.2009.5270600
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-08-10
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Isothermal processes Fatigue System testing Life testing Failure analysis Temperature Thermal loading Electronic packaging thermal management Semiconductor device testing Electronic equipment testing
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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