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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Xiaoli Liu Yunfeng Wang Lei Li Lixi Wan |
| Copyright Year | 2009 |
| Description | Author affiliation: Institute of Microelectronics of Chinese Academy of Sciences 3#, Beitucheng West, Chaoyang District, Beijing, 100029, China (Lixi Wan) || Shenzhen Institute of Advanced Integration Technology Chinese Academy of Sciences/The Chinese University of Hong Kong 1068 Xueyuan Avenue, Shenzhen University Town, Nanshan District, Shenzhen, 518055, China (Xiaoli Liu; Yunfeng Wang; Lei Li) |
| Abstract | Miniaturized printed wire antennas in system in package were investigated for 2.4 GHz wireless communication systems. An inverted F antenna was proposed, and had a small area with 15mm by 15mm. The position of feed tap connected to the antenna arm greatly influenced the impedance of antenna, namely, it could adjust the position of feed tap to match the impedance to 50 ohm. The influences of chips and epoxy molding compounds on the impedance were also studied. Eventually, the inverted F antenna in package had a bandwidth and gain with almost 200MHz and 2.8dB, respectively, and could meet the demands of 2.4GHz wireless communication. |
| Starting Page | 417 |
| Ending Page | 420 |
| File Size | 934306 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781424446582 |
| DOI | 10.1109/ICEPT.2009.5270719 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2009-08-10 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Wire Wireless communication Antenna feeds Impedance Bandwidth Bluetooth Electronics packaging Shape Wireless LAN Joining processes |
| Content Type | Text |
| Resource Type | Article |
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