NDLI: Modeling of nanostructured polymer-metal composite for thermal interface material applications

Content Provider	IEEE Xplore Digital Library
Author	Zhili Hu Carlberg, B. Cong Yue Xingming Guo Johan Liu
Copyright Year	2009
Description	Author affiliation: Shanghai Institute of Applied Mathematics and Mechanics, Shanghai University, Yanchang Road 149, Shanghai 200072, P.R. China (Xingming Guo) \|\| Key Laboratory of Advanced Display and System Applications, Ministry of Education and SMIT Center School of Mechatronics Engineering and Automation, Shanghai University, Shanghai 200072, China (Zhili Hu; Cong Yue; Johan Liu) \|\| SMIT Center and BioNano Systems Laboratory, Department of Microtechnology and Nanoscience Chalmers University of Technology, SE-412 96, Göteborg, Sweden (Carlberg, B.)
Abstract	Previous studies have discovered a unique type of nanostructured polymer-metal composite for thermal interface material with effective thermal conductivity of 8 W/mK. It is a promising result but extensive efforts are still required to further enhance the thermal conductivity. Therefore, this paper will try to help the process with modeling and simulation. Calculations reveal the alignment of the fibers have insignificant influence. Therefore volume percentages of fiber together with mean interface temperature become the dominating parameters of effective thermal conductivities of thermal interface material. Based on this approximation, simulation was taken which showed good results in comparison with experimental data. However, the preferred volume percentage of fibers (33%) was slightly too large according to the surface image of thermal interface material.
Starting Page	481
Ending Page	484
File Size	1062776
Page Count	4
File Format	PDF
ISBN	9781424446582
DOI	10.1109/ICEPT.2009.5270706
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-08-10
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Polymers Composite materials Nanostructured materials Thermal conductivity Electronic packaging thermal management Conducting materials Thermal resistance Thermal management Polyimides Thermal management of electronics
Content Type	Text
Resource Type	Article

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