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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Hui Liu Longzao Zhou Jun Li Fengshun Wu Yiping Wu |
| Copyright Year | 2009 |
| Description | Author affiliation: Department of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, China, 430074 (Hui Liu; Longzao Zhou) || Wuhan National Laboratory for Optoelectronics, Wuhan, China, 430074 (Jun Li; Fengshun Wu; Yiping Wu) |
| Abstract | This study investigates intermetallic compound (IMC) growing behavior at different stand-off heights (SOH) in miniature Cu/Sn-4.8Bi-2Ag/Cu solder joints. The solder joints with SOH of 10, 20, 50 and 100μm will be studied, and the microstructures and compositions will be discussed. Meanwhile the tensile strength and the fracture mode of Sn-4.8Bi-2Ag solder joints will be also studied. The results show that Bi appears as particles spreading over the bulk of the solder joint, which will increase the strength of the solder joint. It is also found that the content of the IMC layer increases as the SOH reduces. The SOH of the solder joint plays an important role in the tensile strength. Tensile strength of the solder joint decreases as the SOH reduces, which correlates with the change of microstructures and compositions in the solder joints. The fractured path of the solder joint transfers from the bulk of the solder joint to the interface between IMC and solder, and the fracture mode tends to be brittle fracture. |
| Starting Page | 1094 |
| Ending Page | 1096 |
| File Size | 2812523 |
| Page Count | 3 |
| File Format | |
| ISBN | 9781424446582 |
| DOI | 10.1109/ICEPT.2009.5270592 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2009-08-10 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Soldering Temperature Microstructure Environmentally friendly manufacturing techniques Lead Testing Materials science and technology Intermetallic Scanning electron microscopy Electronics packaging |
| Content Type | Text |
| Resource Type | Article |
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