NDLI: Warpage prediction of fine pitch BGA by finite element analysis and shadow moiré technique

Content Provider	IEEE Xplore Digital Library
Author	Ke Xue Jingshen Wu Haibin Chen Jingbo Gai Lam, A.
Copyright Year	2009
Description	Author affiliation: Department of Mechanical Engineering, The Hong Kong University of Science and Technology Clear Water Bay, Kowloon, Hong Kong (Ke Xue; Jingshen Wu; Haibin Chen) \|\| ASAT Holdings Limited, Dongguan, China (Lam, A.) \|\| Department of Aeronautics and Astronautics, Harbin Engineering University, Harbin, Heilongjiang Province, China (Jingbo Gai)
Abstract	Warpage is one of the major concerns in manufacturing BGA, CSP, POP or QFN based array packages because a reasonably flat package is critical to successful singulation and board level assembly processes. Warpage of a package is a result of curing shrinkage of encapsulated mold compounds (EMC) and CTE mismatch between various packaging materials. In a completed package, all components are bound together by the crosslinked polymers, i.e. EMC and die-attaching adhesive (D/A). No component can expand or shrink freely. In a typical array package, warpage is in the form of either a ‘crying’ face (corners facing downward) or a ‘smiling’ face (corners facing upward), depending on the correlations of the packaging materials' mechanical, physical and chemical properties. Fine pitch ball grid array (fpBGA) is a chip scale package offering a competitive solution for mobile applications. Package thickness ranges from 1.4mm down to 0.6mm with ball pitches as small as 0.4mm. Since the package is very thin, warpage control is a big challenge. In this study, an accurate finite element model, incorporated appropriate material properties was developed to predict the warpage of fpBGA under reflow condition. The experimental measurements of the warpage behavior of the fpBGA under solder-reflow condition were conducted using an Akrometrix TherMoire PS200. The experimental results were compared with the results of FE analysis, which provides feedbacks for modeling optimization. Effects of material properties and geometric parameters on thermal warpage were then studied using the optimized models.
Starting Page	317
Ending Page	321
File Size	1421261
Page Count	5
File Format	PDF
ISBN	9781424446582
DOI	10.1109/ICEPT.2009.5270742
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-08-10
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Finite element methods Chip scale packaging Electromagnetic compatibility Semiconductor device modeling Material properties Manufacturing processes Assembly Curing Polymers Chemicals
Content Type	Text
Resource Type	Article

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