NDLI: Dramatic morphological change of interfacial prism-type Cu6Sn5 in the Sn3.5Ag/Cu joints reflowed by induction heating

Content Provider	IEEE Xplore Digital Library
Author	Ling Wang Hongbo Xu Ming Yang Mingyu Li Yonggao Fu
Copyright Year	2009
Description	Author affiliation: China National Electric Apparatus Research (Ling Wang; Yonggao Fu) \|\| State Key Laboratory of Advanced Welding Production Technology Harbin Institute of Technology Shenzhen Graduate School (Hongbo Xu; Ming Yang; Mingyu Li)
Abstract	Ball grid array (BGA) solder interconnecting is one of the key technologies in electronic packaging and assembly. Legislation of lead-free process has made the application of lead-free solder become wider in electronic products. Compared to the lead-tin solder, the relatively higher melting points of most lead-free solders call for a higher reflow temperature. Thus conventional integral-heating process at an elevated temperature would induce severe warpage of components and substrates and reduce the in-service reliability of solder joint. In this dissertation, a new concept of selective heating was proposed to address the reliability issues of integral heating process in lead-free BGA interconnection. By using this concept a novel BGA interconnection technology, named as induction heating reflow, is developed. The significance of this research lies in the potentials of acceleration of the lead-free process in electronic productions, promotion in the applicability of lead-free BGA packaging, and the enhancement of the reliability of BGA components. Compared with conventional hot-air reflow, the thermal characteristics of liquid-solid interfacial reaction and solid-solid interfacial reaction, the formation of interfacial intermetallic compound (IMC) and their growth kinetics were all studied. The result shows that with the increasing of temperature, Cu6Sn5 grains change from scallop-type into prism-type. In the solid-state aging process the evolution of interfacial IMC is merely controlled by the diffusion of Cu atoms from pad, and its thickness grows linearly with the square root of aging time.
Starting Page	843
Ending Page	846
File Size	2412987
Page Count	4
File Format	PDF
ISBN	9781424446582
DOI	10.1109/ICEPT.2009.5270627
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-08-10
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Environmentally friendly manufacturing techniques Lead Temperature Electronics packaging Heating Electronic packaging thermal management Aging Assembly Legislation Soldering
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Intermetallic growth studies on SAC/ENIG and SAC/Cu-OSP lead-free solder joints

Automatic and Secure Rework in a Lead-Free Environment

Evaluation of fatigue strength for solder joints after thermal aging

Lead-free soldering effect to tantalum capacitors

Effect of Cu addition in sn-containing solder joints on interfacial reactions with Au foils

Thermal Characters Analysis of Induction-Self-Heating-Reflow for Solders Bumping

Behavior of Lead Free Solder Joint after Thermal Treatment

Interfacial reactions and drop reliabilities of lead-free solder joints with electrolytic Cu metallizations.

Intermetallic growth of Sn-Ag-Sb/Ni plated Cu in power packaging subject to thermal aging

Dramatic morphological change of interfacial prism-type Cu6Sn5 in the Sn3.5Ag/Cu joints reflowed by induction heating

Similar Documents

Intermetallic growth studies on SAC/ENIG and SAC/Cu-OSP lead-free solder joints

Automatic and Secure Rework in a Lead-Free Environment

Evaluation of fatigue strength for solder joints after thermal aging

Lead-free soldering effect to tantalum capacitors

Effect of Cu addition in sn-containing solder joints on interfacial reactions with Au foils

Thermal Characters Analysis of Induction-Self-Heating-Reflow for Solders Bumping

Behavior of Lead Free Solder Joint after Thermal Treatment

Interfacial reactions and drop reliabilities of lead-free solder joints with electrolytic Cu metallizations.

Intermetallic growth of Sn-Ag-Sb/Ni plated Cu in power packaging subject to thermal aging

Dramatic morphological change of interfacial prism-type Cu6Sn5 in the Sn3.5Ag/Cu joints reflowed by induction heating