NDLI: Effect of miniaturization on the microstructure and mechanical property of solder joints

Content Provider	IEEE Xplore Digital Library
Author	Bo Wang Fengshun Wu Jin Peng Hui Liu Yiping Wu Yuebo Fang
Copyright Year	2009
Description	Author affiliation: Wuhan National Laboratory for Optoelectronics Huazhong University of Science and Technology, Wuhan, P. R. China, 430074 (Bo Wang; Fengshun Wu; Yiping Wu) \|\| Ningbo Kangqiang Electronics Co., LTD, Ningbo, P.R. China, 315105 (Yuebo Fang) \|\| State Key Laboratory of Materials Processing and Die & Mould Technology Huazhong University of Science and Technology, Wuhan, P. R. China, 430074 (Jin Peng; Hui Liu)
Abstract	In present paper, the effect of miniaturization on the microstructure and mechanical property of solder joints is investigated. With the miniaturization of solder joints, the thickness of IMC decreases, while, the IMC proportion to the solder joint increases; meanwhile, the concentrations of base materials in the bulk also increase with the reducing stand-off height (SOH). Due to the interaction of interfacial reactions in the Cu/Sn/Ni solder joints, the IMC layers with incompact connection are formed at Ni side, and tensile test results show that the incompact IMC are the weakest part in the solder joints. When the SOH reduces to 10μm, the solder bulk contains only one grain in height in the Cu/Sn/Cu and Cu/Sn/Ni solder joints, leading to dramatic changes in fracture mode and the ultimate tensile strength (UTS). When the SOH is lowered to 10μm, the UTS of Cu/Sn/Ni solder joints decreases dramatically to be lower than that of Cu/Sn/Cu solder joints.
Starting Page	1149
Ending Page	1154
File Size	5350442
Page Count	6
File Format	PDF
ISBN	9781424446582
DOI	10.1109/ICEPT.2009.5270608
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-08-10
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Microstructure Mechanical factors Soldering Tin Bars Surface morphology Materials science and technology Paper technology Testing Lead
Content Type	Text
Resource Type	Article

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