NDLI: The effects of bonding parameters on the reliability performance of flexible RFID tag inlays packaged by anisotropic conductive adhesive

Content Provider	IEEE Xplore Digital Library
Author	Xiong-hui Cai Xian-cai Chen Bing An Feng-shun Wu Yi-ping Wu
Copyright Year	2009
Description	Author affiliation: State Key Lab of Manufacturing Equipment & Technology, Huazhong University of Science and Technology, Wuhan, 430074, China (Xian-cai Chen) \|\| College of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074, China (Xiong-hui Cai; Bing An; Feng-shun Wu; Yi-ping Wu)
Abstract	In this work, ACA was prepared by mixing micro-sized spherical Ag particles into thermo-set epoxy resin, and RFID flip chips were assembled on the Al/PET antennae through hot-press process. The effect of bonding parameters, such as the curing degree, the curing rate and the temperature combination of down and up hot-press heads on the contact resistance and shear strength of ACA bonding joints for flexible RFID application were studied. And the reliability test (high-temperature and humidity test, 85°C, 85% relative humidity, 288 hrs) was also used to investigate the reliability of RFID tag inlays. It was found that these bonding parameters had great effect on the mechanical and electrical performance of bonding joints. For this ACA prepared here, the optimum bonding parameters for flexible RFID tag inlays was that: the curing degree is 85%, the curing rate is 15s / 170°C, and the temperature of down and up hot-press heads are 180°C/160°C.
Starting Page	1054
Ending Page	1058
File Size	4180434
Page Count	5
File Format	PDF
ISBN	9781424446582
DOI	10.1109/ICEPT.2009.5270585
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-08-10
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Bonding RFID tags Packaging Anisotropic magnetoresistance Conductive adhesives Curing Radiofrequency identification Temperature Testing Humidity
Content Type	Text
Resource Type	Article

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