NDLI: Thermal-mechanical fatigue reliability of pbsnag solder layer of die attachment for power electronic devices

Content Provider	IEEE Xplore Digital Library
Author	Xinpeng Xie Xiangdong Bi Guoyuan Li
Copyright Year	2009
Description	Author affiliation: Guangdong Yuejing High Technology Co. Ltd., Guangzhou 510663, China (Xiangdong Bi) \|\| School of Electronic and Information Engineering, South China University of Technology, Guangzhou 510641, China (Xinpeng Xie; Guoyuan Li)
Abstract	PbSnAg solder was widely used in die attachment for high power chip packaging, and the thermal-mechanical reliability of PbSnAg solder layer is a key factor to evaluate the quality of high power devices packaging. Viscoplastic finite-element simulation methodologies were utilized to predict Pb92.5Sn5Ag2.5 solder joint reliability for die attachment under accelerated temperature cycling conditions (−55°C to +125°C, 10min ramps/20min dwells). The behavior of solder under accelerated temperature cycling was described by Anand's viscoplastic constitutive equations and the fatigue life prediction was investigated in volume-average-energy method by R. Darveaux. Three finite-element models (2D plane model, 3D slice model and 3D quarter model) were established to validate the results, and the response of different chip size for die attach was discussed to optimize the fatigue life. The results show that, the maximum plastic stress, strain, and plastic energy were found at the corner or on the edge of the solder layer, which is the week point leading to initial crack damage in the leadframe-solder-die interfaces. With increasing in temperature cycles, the stress-strain hysteretic loops of the dangerous position have a steady trend. The plastic energy accumulated within temperature cycle becomes larger while the increment of plastic energy per cycle trends to be stable. Also, chip size has some influences on the thermal reliability. With increasing in chip size, the maximum plastic stress and strain at the dangerous position increase, which could lead to poor reliability of the die attachment.
Starting Page	1181
Ending Page	1185
File Size	1037949
Page Count	5
File Format	PDF
ISBN	9781424446582
DOI	10.1109/ICEPT.2009.5270615
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-08-10
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Fatigue Power electronics Plastics Electronic packaging thermal management Temperature Lead Finite element methods Acceleration Capacitive sensors Thermal factors
Content Type	Text
Resource Type	Article

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