NDLI: A novel research on micro-ball placement machine used for wafer level package

Content Provider	IEEE Xplore Digital Library
Author	Jinsong Liu
Copyright Year	2009
Description	Author affiliation: Shanghai Athele Automation Equipment Co. 1-2F, No.90 Bldg, 1122 Qin Zhou Bei Road, Shanghai, China (Jinsong Liu)
Abstract	Wafer Level Package (WLP) is a good way to resolve the fine pitch high density IC production. In formal way, it is done by producing bumps on wafers. Several ways to produce bumps are available, such as stencil printing, imprint & photolithography. But the bumps height can not be controlled well in the above methods. Since the micro balls are mass produced in the same size (general less than 3% error on balls diameter), if we can place the micro balls on the wafer in the a proper way, it is a good solution for WLP. A new method and a machine presented here are introduced. The minimum ball size is 60μm in diameter. Using this kind of machine, the bumps producing process can be shorted and cost down and avoid producing mistakes. In this paper, the basic apparatus introduction and ball placing mechanical pictures are given. The machine has been used in the IC research and fab production since 2008.
Starting Page	824
Ending Page	826
File Size	1205577
Page Count	3
File Format	PDF
ISBN	9781424446582
DOI	10.1109/ICEPT.2009.5270634
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-08-10
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Packaging machines Wafer scale integration Costs Printing Chip scale packaging Resists Routing Etching Production Substrates
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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