NDLI: Characteristic analysis of transducer drive current in ultrasonic wire bonding process

Content Provider	IEEE Xplore Digital Library
Author	Shaohua Liu Fuliang Wang
Copyright Year	2009
Description	Author affiliation: Key Laboratory of Modern Complex Equipment Design and Extreme Manufacturing, Ministry of Education, Central South University, Changsha 410083, China (Shaohua Liu; Fuliang Wang)
Abstract	In the ultrasonic wire bonding process, the impedance change of transducer system was reflected by the current amplitude, the change of the system's resonance frequency was represented by the change of the current's frequency. The current signals contained much information about the bonding process and the resulted bond quality. The characteristics of current were depending on the tip states. Free, fixed, or damped tips led to different characteristics of current in some way. The bond formation process and the related physical process can be reflected by the current characteristics during bonding process. In this paper the current monitoring hardware system was set up for ultrasonic wire bonding, and the relevant software was designed. The reliable current signals had been acquired by data acquisition system and the bonding quality data was gathered by measuring the bonding shearing force. The current signals were analyzed by using the wavelet time-frequency method. Several characteristics were selected. The analysis results indicated that the frequency, the amplitude value and the change tendency of current signals are related to the bonding quality in certain extent. The fundamental resonance frequency deviation, very small current, and exceptional current changing tendency always mean failed bond.
Starting Page	1159
Ending Page	1163
File Size	641834
Page Count	5
File Format	PDF
ISBN	9781424446582
DOI	10.1109/ICEPT.2009.5270610
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-08-10
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Ultrasonic transducers Wire Bonding processes Resonance Resonant frequency Bonding forces Force measurement Signal analysis Impedance Signal processing
Content Type	Text
Resource Type	Article

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