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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Chunyue Huang Ying Liang Tianming Li |
| Copyright Year | 2009 |
| Description | Author affiliation: School of Electro-Mechanical Engineering, Guilin University of Electronic Technology, Guilin, 541004, China (Chunyue Huang) || Dept. of Science and Technology, Guilin College of Aerospace Technology, Guilin, 541004, China (Tianming Li) || Chengdu Aeronautic Vocational and Technical College, Chengdu, 610021, China (Ying Liang) |
| Abstract | Three parameters, Copper pad material, Pad thickness, and Bump Patterns were chosen as three control factors. By using an L9(34)orthogonal array the copper stud bump solder joints which have 9 different combinations of parameters were designed. The finite element analysis models of 9 copper stud bump solder joints were established by using ANSYS/LS-DYNA, and analyzed the finite element tensile simulation. Tensile strain data of copper stud bump solder joint were obtained under 9 different parameters combinations; it was analyzed through range analysis and variance analysis. The result shows that of the three parameters, the descending order of affecting the copper stud bump solder joint tensile strain is Copper pad material, Bump Patterns, and Pad thickness. With 95% confidence, Copper pad material has a significant effect on the copper stud bump solder joint tensile strain whereas bump patterns and pad thickness has little. |
| Starting Page | 358 |
| Ending Page | 361 |
| File Size | 1008605 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781424446582 |
| DOI | 10.1109/ICEPT.2009.5270734 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2009-08-10 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Copper Costs Analysis of variance Bonding Soldering Finite element methods Tensile strain Materials science and technology Shape control Educational institutions |
| Content Type | Text |
| Resource Type | Article |
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