NDLI: Effects of service parameters on thermomechanical fatigue behaviors of new nano composite solder joints

Content Provider	IEEE Xplore Digital Library
Author	Tai, F. Guo, F. Liu, B. Xia, Z.D. Shi, Y.W.
Copyright Year	2009
Description	Author affiliation: College of Materials Science and Engineering, Beijing University of Technology (Tai, F.; Guo, F.; Liu, B.; Xia, Z.D.; Shi, Y.W.)
Abstract	Thermomechanical fatigue (TMF) resulted from the mismatch in the coefficient of thermal expansion (CTE) between solder and substrate would degrade the mechanical properties of solder joints during service. In this research, nano-structured polyhedral oligomeric silsesquioxane (POSS) reinforcing particles were incorporated into a promising lead-free solder, eutectic Sn-3.5Ag solder, by mechanically mixing to improve service reliability of the base solder matrix. Three different temperature profiles, with the same temperature extremes of −40°C to 125°C, different dwell times at temperature extremes and ramp rates, were applied in the tests. Microstructural characterization of surface damage and residual shear strength of these solder joints were carried out after 0, 100, 250, 500 and 1000 TMF cycles. Results obtained from this study were used to analyze the effect of service parameters on the TMF behaviors of the nano composite solder joints. Experimental results indicated that the nano composite solder joints exhibited better TMF performance than the eutectic Sn-Ag solder joint. It also proved that the nano composite solder joints that experienced longer dwell time and slower ramp rate exhibited less surface damage accumulation and less decrease in shear strength of solder joints.
Starting Page	753
Ending Page	758
File Size	8358762
Page Count	6
File Format	PDF
ISBN	9781424446582
DOI	10.1109/ICEPT.2009.5270647
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-08-10
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thermomechanical processes Fatigue Soldering Temperature Thermal expansion Thermal degradation Mechanical factors Environmentally friendly manufacturing techniques Lead Testing
Content Type	Text
Resource Type	Article

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Thermo-mechanical damage accumulation during power cycling of lead-free surface mount solder joints

Effect of Ramp Rate on Microstructure and Properties of Thermomechanically-Fatigued Sn-3.5Ag Based Composite Solder Joints

Investigation of solder joints strength

The degradation of solder joints under high current density and low-cycle fatigue

Effects of Element Partition on the Fatigue Life Predictions of Lead-Free Solder Joints

Chapter 5, Modeling and characterization of solder joints

Isothermal cyclic bend fatigue test method for lead free solder joints

Evaluation of fatigue strength for solder joints after thermal aging

Study on fatigue strength characteristics for solder joints

Effects of service parameters on thermomechanical fatigue behaviors of new nano composite solder joints

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