NDLI: Study on a 3D packaging structure with benzocyclobutene as a dielectric layer for radio frequency application

Content Provider	IEEE Xplore Digital Library
Author	Fei Geng Xiaoyun Ding Le Luo
Copyright Year	2009
Description	Author affiliation: Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China, Changning Road 865 (Fei Geng; Xiaoyun Ding; Le Luo)
Abstract	A new wafer-level 3D packaging structure with benzocyclobutene (BCB) as interlayer dielectrics (ILDs) for multichip module fabrication is proposed for the application in radio frequency. The packaging structure consists of two layers of BCB films and three layers of metalized films, in which the monolithic microwave IC (MMIC), thin film resistors, strip lines and microstrip lines are integrated. Wet etched cavities fabricated on the silicon substrate are used for mounting the active and passive components. BCB layers cover on the components and serve as ILDs for interconnections. Gold bumps are used as electric interconnections between different layers, which eliminate the need of preparing vias by costly dry etching and deposition process. In order to get highly qualitied BCB films for the subsequent chemical mechanical planarization (CMP) and multilayer metallization processes, the BCB curing profile is optimized and the roughness of the BCB film after CMP process is controlled lower than 10nm. The thermal, mechanical and electrical properties of the packaging structure are investigated. The thermal resistance can be controlled below 2 °C/W. The average shear strength of the gold bumps on the BCB surface is around 70 $N/mm^{2}.$ The performances of MMIC and interconnection structure in high frequency are optimized and tested. The S-parameters curves of the packaged MMIC shift slightly showing perfect transmission character. The insertion loss (S21) change after the packaging process is less than 1db range at the operating frequency. And the return loss (S11) is less than −8 dB from 10GHz to 15 GHz.
Starting Page	85
Ending Page	90
File Size	1819585
Page Count	6
File Format	PDF
ISBN	9781424446582
DOI	10.1109/ICEPT.2009.5270787
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-08-10
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Packaging Radio frequency Dielectric thin films MMICs Wafer scale integration Gold Thermal resistance Surface resistance Multichip modules Fabrication
Content Type	Text
Resource Type	Article

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