NDLI: Studies on microstructure of epoxy molding compound (EMC)-Leadframe interface after environmental aging

Content Provider	IEEE Xplore Digital Library
Author	Xiuzhen Lu Li Xu Huaxiang Lai Xinyu Du Liu, J. Zhaonian Cheng
Copyright Year	2009
Description	Author affiliation: Key Laboratory of Advanced Display and System Applications, Ministry of Education and SMIT Center, School of Mechatronics Engineering and Automation, Shanghai University, Shanghai 200072, China (Xiuzhen Lu; Li Xu; Huaxiang Lai; Liu, J.; Zhaonian Cheng) \|\| Henkel Corporation, 15350 Barranca Pkwy, Irvine CA 92618, USA (Xinyu Du)
Abstract	The Leadframe-Epoxy molding compound (EMC) interface is known to be one of the weakest interfaces in an electronic packaging exhibiting delamination during reliability test. Interfaces of EMC and leadframes with different metal coatings exhibit different failure mode behavior after environmental aging because of the different adhesion strengths. In this paper, the interface microstructure of EMC-leadframes with different metal coatings was studied using Scanning Electron Microscopy (SEM). The leadframes used in this study were copper, copper with Ag coating, Ni coating and Ni/Pd/Au coating. The results of tab pull testing showed the adhesion strength of the EMC/copper leadframe interface was strongest while that of the EMC/leadframe with Ni/Pd/Au coating interface was weakest. Little delamination appeared on the EMC/Cu sample, including the samples after the moisture and reflow treatment. Delamination appeared on the interface of EMC/leadframe with Ag coating after treatment, and serious delamination was found on the interface of EMC/leadframe with Ni coating. The SEM micrographs showed that there were some microcracks between the filler of EMC and the leadframe.
Starting Page	1051
Ending Page	1053
File Size	1321747
Page Count	3
File Format	PDF
ISBN	9781424446582
DOI	10.1109/ICEPT.2009.5270584
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-08-10
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Microstructure Aging Electromagnetic compatibility Coatings Delamination Copper Scanning electron microscopy Adhesives Gold Lead compounds
Content Type	Text
Resource Type	Article

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