NDLI: Study of tungsten metallization surface states for multilayer ceramic

Content Provider	IEEE Xplore Digital Library
Author	Wenjuan Zhang Huajiang Jin
Copyright Year	2009
Description	Author affiliation: Hebei Semiconductor Research Institute P. O. Box 179-41, Shijiazhuang Hebei, P. R. China (Wenjuan Zhang; Huajiang Jin)
Abstract	Ceramics are widely used in high reliable microelectronic packaging for their good electricity, thermal, mechanical characteristics and dimension stability [1]. Metallization of multilayer ceramic is one of the key techniques affecting the packaging quality and reliability. Metallization conductor should have appropriate resistivity, compact structure and can be co-fired with ceramic etc. There are many reports about Mo-Mn metallization technology, but rare about multilayer ceramic tungsten metallization especially about its surface states [2]. Surface states of metallization affect the adhesive strength, airtightness character and reliability of nickel-plating directly. The tungsten metallization surface state of three pastes was analyzed with SEM and EDS. Study the influence of viscosity, printing parameters, conductor thickness, sintering cycle etc. In order to analyze the effects of microstructure to the performance and surface quality of products, metallization surface states of every product was observed. The experiments indicated that two of the three pastes have alumina grains in the metallization surface after printing. According to the printing parameters, the printing process influences the surface state but doesn't have obvious effect on grains. The amounts of grains decrease with the increase of conductor's thickness. After fired, the ceramic grains in the conductor grow up apparently. The results indicated that adhesion of the metallization can be controlled by adjusting the sintering temperature and soaking time. For the ceramic grains exists in the nickel layer, the nickel layer has many impurities which affect the roughness of nickel-plating apparently. In a word, control metallization state and optimize process parameters are very important to the quality and reliability of products.
Starting Page	548
Ending Page	551
File Size	1454786
Page Count	4
File Format	PDF
ISBN	9781424446582
DOI	10.1109/ICEPT.2009.5270689
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-08-10
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Tungsten Metallization Nonhomogeneous media Ceramics Conductors Printing Packaging Nickel Microelectronics Thermal stability
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Multilayer printing on PDMS-ceramic composites for RF integration and packaging

Automatic Batch Processing in Multilayer Ceramic Metallization

Multilayer glass ceramic substrate design for SS-1 supercomputer

A study of metallization processing ceramic package

LPCVD Tungsten Filled vias for Multilayer Metallization

A 3-D low-cost packaging technology for ceramic substrates

Design of low dielectric glass+ceramics for multilayer ceramic substrate

High performance packaging with multilayer ceramic antenna switch module for wireless communication

The study on pad of AlN multilayer cofire ceramic substrate

Study of tungsten metallization surface states for multilayer ceramic

Similar Documents

Multilayer printing on PDMS-ceramic composites for RF integration and packaging

Automatic Batch Processing in Multilayer Ceramic Metallization

Multilayer glass ceramic substrate design for SS-1 supercomputer

A study of metallization processing ceramic package

LPCVD Tungsten Filled vias for Multilayer Metallization

A 3-D low-cost packaging technology for ceramic substrates

Design of low dielectric glass+ceramics for multilayer ceramic substrate

High performance packaging with multilayer ceramic antenna switch module for wireless communication

The study on pad of AlN multilayer cofire ceramic substrate

Study of tungsten metallization surface states for multilayer ceramic