NDLI: Localized recrystallization and cracking behavior of lead-free solder interconnections under thermal cycling

Content Provider	IEEE Xplore Digital Library
Author	Chen, H.T. Mattila, T. Li, J. Liu, X.W. Li, M.Y. Kivilahti, J.K.
Copyright Year	2009
Description	Author affiliation: Shenzhen Graduate School, Harbin Institute of Technology, Shenzhen, 518055, China (Chen, H.T.; Li, M.Y.) \|\| Laboratory of materials science, Helsinki University of Technology, P.O. Box 6200, 02015, Finland (Liu, X.W.) \|\| Laboratory of Electronics Production Technology, Helsinki University of Technology, P. O. Box 3000, 02015, Finland (Mattila, T.; Li, J.; Kivilahti, J.K.)
Abstract	The failure mechanism of lead-free solder interconnections under thermal cycling has been studied by cross-polarized light microscopy, scanning electronic microscopy (SEM), and nanoindentation test. From the results of finite element modeling (FEM), it was found that the critical solder interconnection was located at the chip corner, and the stress was concentrated at the outer neck region beneath the ball grid arrays (BGA) component. The FEM results were in good agreement with the experimental observation. Two failure modes of the interconnections were identified: one is the intergranular or transgranular cracking through many small equiaxed recrystallized grains and the other is the transgranular cracking in few large irregularly shaped recrystallized grains. The results show that the localized recrystallization makes the Ag3Sn intermetallic compounds (IMC) coalesce and distribute sparsely, which leads to the degradation of the recrystallized microstructure and easy propagation of the cracks.
Starting Page	562
Ending Page	568
File Size	2154228
Page Count	7
File Format	PDF
ISBN	9781424446582
DOI	10.1109/ICEPT.2009.5270688
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-08-10
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Environmentally friendly manufacturing techniques Lead Scanning electron microscopy Failure analysis Numerical analysis Electronic equipment testing Finite element methods Thermal stresses Neck Electronics packaging
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Reliability of Lead-Free Solder Interconnections in Thermal and Power Cycling Tests

Characterization of Nanoparticles of Lead Free Solder Alloys

A stress-life methodology for ball grid array lead-free and tin-lead solder interconnects under impact conditions

Microstructural coarsening of lead free solder joints during thermal cycling

A reliability evaluation of lead-free ball grid array (BGA) solder joints through mechanical fatigue testing

Thermal fatigue analysis of a CBGA package with lead-free solder fillets

Failure analysis of lead-free solder joints for flip chip on board

The effect of thermal cycling on nanoparticle reinforced composite lead-free solder

Novell test concept for experimental lifetime prediction of miniaturized lead-free solder contacts

Localized recrystallization and cracking behavior of lead-free solder interconnections under thermal cycling

Similar Documents

Reliability of Lead-Free Solder Interconnections in Thermal and Power Cycling Tests

Characterization of Nanoparticles of Lead Free Solder Alloys

A stress-life methodology for ball grid array lead-free and tin-lead solder interconnects under impact conditions

Microstructural coarsening of lead free solder joints during thermal cycling

A reliability evaluation of lead-free ball grid array (BGA) solder joints through mechanical fatigue testing

Thermal fatigue analysis of a CBGA package with lead-free solder fillets

Failure analysis of lead-free solder joints for flip chip on board

The effect of thermal cycling on nanoparticle reinforced composite lead-free solder

Novell test concept for experimental lifetime prediction of miniaturized lead-free solder contacts

Localized recrystallization and cracking behavior of lead-free solder interconnections under thermal cycling