NDLI: Fatigue evaluation of power devices

Content Provider	IEEE Xplore Digital Library
Author	Shinohara, K. Qiang Yu
Copyright Year	2009
Description	Author affiliation: Kanagawa Academy of Science and Technology KSP, 3-2-1 Sakado, Takatsu-ku, Kawasaki City, Kanagawa, 213-0012, Japan (Shinohara, K.) \|\| Yokohama National University 79-5, Tokiwadai, Hodogaya-ku Yokohama, 240-8501, Japan (Qiang Yu)
Abstract	Semiconductors are solids whose electrical conductivity is intermediate between that of a conductor and an insulator. Semiconductor devices are active devices that consume, accumulate, and discharge the supplied electric power. They are used as electronic or power devices. The former are employed in the control systems of electrical products such as mobile phones and computers, which are controlled by electrical currents. Power devices are also controlled by currents, but these currents are the main energy sources of the electrical products. Therefore, the Joule heating generated in power devices is much larger than that generated in electronic devices. This heating is concentrated at a single point on the body of the device, where deterioration due to strain is localized. There is an increasing need for power devices that are lightweight and compact. However, reducing the weight of power devices would result in reduced stiffness, and greater compactness would results in increased current density, which, in turn, would increase the temperature threshold of the device. Thus, to realize lightweight, compact power devices with sufficient reliability, multiphysics fatigue analysis techniques that simultaneously consider electricity, heat, and stress should be developed. In the literature [1–16], a FEM-based lifetime model for AI wire has been derived. Methods for thermal analysis of power devices considering the wire connection layout have been analyzed using 3D FEM simulation, and a FEM-based evaluation method has been presented. The thermal fatigue reliability of power devices has also been described. In one such study, coupled thermal-electrical and thermal-structural analyses were performed to evaluate the fatigue behavior of these devices. Then, crack propagation in the device was evaluated. In the present study, to accurately predict the fatigue properties of power devices, evaluation techniques based on multiphysics analysis are proposed.
Starting Page	1277
Ending Page	1283
File Size	1895645
Page Count	7
File Format	PDF
ISBN	9781424446582
DOI	10.1109/ICEPT.2009.5270605
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-08-10
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Fatigue Control systems Electrical products Heating Power generation Wire Solids Conductivity Conductors Dielectrics and electrical insulation
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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