NDLI: Advanced moisture diffusion model and hygro-thermo-mechanical design for flip chip BGA package

Content Provider	IEEE Xplore Digital Library
Author	Ming-Han Tsai Feng-Jui Hsu Meng-Chieh Weng Hsiang-Chen Hsu
Copyright Year	2009
Description	Author affiliation: Department of Mechanical and Automation Engineering, I-Shou University No. 1, Sec. 1, Syuecheng Rd., Dashu Township, Kaohsiung County, Taiwan 84008 (Ming-Han Tsai; Feng-Jui Hsu; Meng-Chieh Weng; Hsiang-Chen Hsu)
Abstract	In the present paper, a comprehensive moisture diffusion model and characterization for encapsulated plastic Flip Chip (FC) Ball Grid Array (BGA) package are investigated. The transient moisture diffusion analysis described by Fick's second law is performed to evaluate the overall moisture distribution. Diffusivities in the moisture desorption model are determined under Arrhenius behaviors. Hygroscopic swelling properties of polymeric materials are characterized by using an existing TMA/TGA extraction method. With the so-called “thermal-wetness” analogous technique, finite element analysis (FEA) is developed to evaluate the entire moisture distribution on FC BGA package. The analytical expression for total expansion strain due to hygro-thermo-mechanical coupled effect is implemented using finite element software ANSYS. Finite element predictions reveal the significance of contribution of hygroswelling induced strain. Reliability analysis for FC BGA is performed in accordance with JEDEC standard JESD22-A120. A series of comprehensive experimental works and parametric studies are conducted in this research.
Starting Page	1002
Ending Page	1008
File Size	935829
Page Count	7
File Format	PDF
ISBN	9781424446582
DOI	10.1109/ICEPT.2009.5270573
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-08-10
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Moisture Flip chip Finite element methods Transient analysis Performance analysis Capacitive sensors Electronics packaging Plastic packaging Performance evaluation Polymers
Content Type	Text
Resource Type	Article

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