NDLI: Study on reliability of embedded passives in organic substrate

Content Provider	IEEE Xplore Digital Library
Author	Weiyang Qiu Kailin Pan Chaoping Yuan Jiaopin Wang
Copyright Year	2009
Description	Author affiliation: School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology No.1 Jinji Road, Guilin, China, 541004 (Weiyang Qiu; Kailin Pan; Chaoping Yuan; Jiaopin Wang)
Abstract	Embedded passives represent a promising solution regarding the reduction of size and assembly costs of system in package (SiP). In addition, the benefits also include improvements in electrical performance and reliability. Although embedded passives are more reliable by elimination solder joint interconnects, they also introduce other concerns such as deformation and component instability. More layers may be needed to accommodate the embedded passives, and various materials within the substrate may cause significant thermo-mechanical stress due to coefficient of thermal expansion (CTE) mismatch. Due to the embedded substrate include viscoelastic material, the Maxwell model was applied to describe the viscoelastic behavior of embedded capacitor in the FR4 substrate series, and the constitutive equations of the Maxwell model were obtained. The three dimensional finite element model of embedded capacitor is developed. And the thermo-mechanical deformation of embedded capacitor is investigated after accelerated thermal cycling (−55°C to 125°C) based on the American military standard (MIL). The result shows that the maximum displacement takes place at the both sides of the middle edges. And the deformation leads to the distance of capacitor electrodes increase, which results in decrease of capacitance. The biggest reduction of capacitance is approximate 10% after thermal cycling, but embedded substrate is baked before thermal cycling can prevent the capacitance from decreasing and the change of capacitor is less than 5%. From 100MHz to 1GHz, the signal integrity of micro-via is investigated and the model is developed. The signal micro-via including one ground-via have obvious resonance peaks around the 1GHz. Compare with one ground-via, the resonant peak of micro-via including four ground-via that array symmetrically can be inhibited. In addition, the insertion loss and return loss of the micro-via including four ground-vias are less than that including only one ground-via.
Starting Page	123
Ending Page	127
File Size	1296295
Page Count	5
File Format	PDF
ISBN	9781424446582
DOI	10.1109/ICEPT.2009.5270779
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-08-10
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Capacitors Capacitance Thermomechanical processes Thermal stresses Viscosity Elasticity Resonance Assembly systems Costs Packaging
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Physics-based reliability assessment of embedded passives

Study on process of embedded passives based on FR4 substrate series

Enhancement of fast-flow underfill performance by use of silane additives

Reliability Modeling and Assessment of Embedded Capacitors in Organic Substrates

Emerging reliability challenges in electronic packaging

Reliability development and qualification of a low-cost, PQFP-based MCM

Adhesives as a thermomechanical stress source-comparing silicones to epoxies

Sequential process modeling of SLIM substrate fabrication

Effect of Chemistry on Viscoelastic Properties of Moulding Compounds

Study on reliability of embedded passives in organic substrate

Similar Documents

Physics-based reliability assessment of embedded passives

Study on process of embedded passives based on FR4 substrate series

Enhancement of fast-flow underfill performance by use of silane additives

Reliability Modeling and Assessment of Embedded Capacitors in Organic Substrates

Emerging reliability challenges in electronic packaging

Reliability development and qualification of a low-cost, PQFP-based MCM

Adhesives as a thermomechanical stress source-comparing silicones to epoxies

Sequential process modeling of SLIM substrate fabrication

Effect of Chemistry on Viscoelastic Properties of Moulding Compounds

Study on reliability of embedded passives in organic substrate