NDLI: An improved substructure method for prediction of solder joint reliability in thermal cycle

Content Provider	IEEE Xplore Digital Library
Author	Fei Liu Lihua Liang Yong Liu
Copyright Year	2009
Description	Author affiliation: Fairchild-ZJUT Microelectronic Packaging Joint Lab, Zhejiang University of Technology, Hangzhou, 310032, China (Fei Liu; Lihua Liang; Yong Liu)
Abstract	With the current trend of less expensive, faster, and better electronic products, it has become increasingly important to evaluate the IC package and system performance early in the design stage using simulation tools. For the solder joint subjected to cyclic stresses generated during the thermal cycling, its reliability depends on its resistance to creep and fatigue. The approach for simulation in this paper includes advanced finite element modeling with sub-structuring method. To simplify the analysis the temperature cycle is divided into different portions, and correspondingly the material properties are specified at that temperature range. The material properties are assumed to be linear and the equivalent elastic modulus corresponding to a specified temperature is got based on similar critical solder joint deflection. All non-critical solder joints with equivalent elastic modulus are condensed into a super-element with substructure analysis. At different temperatures, non-critical solder joints with specified equivalent elastic modulus are condensed in a serial of super-elements. To use different super-elements, windows batch command and ANSYS batch mode are used for automatic super-element generation and analysis.
Starting Page	311
Ending Page	316
File Size	1533409
Page Count	6
File Format	PDF
ISBN	9781424446582
DOI	10.1109/ICEPT.2009.5270741
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-08-10
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Soldering Electronic packaging thermal management Thermal stresses Thermal resistance Temperature distribution Material properties Integrated circuit packaging System performance Creep Fatigue
Content Type	Text
Resource Type	Article

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