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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Jifan Wang Yuming Ye Junying Zhao Sang Liu Yunhua Tu Song Li Zhiwei Song |
| Copyright Year | 2009 |
| Description | Author affiliation: Huawei Technologies Co., LTD. Shenzhen, Guangdong, P.R. China (Jifan Wang; Yuming Ye; Junying Zhao; Sang Liu; Yunhua Tu; Song Li; Zhiwei Song) |
| Abstract | Quick and effective reliability assessment method is one of aspired targets for product development and test. Base on specific design board, this paper study the effect of four-point cyclic bend test parameters, such as deflection and temperature to lead-free solder joint fatigue life and failure mode, compare the performance of lead-free joints in four-point cyclic bend and accelerated temperature cycling (ATC), explore the application of four-point cyclic bend test method in lead-free solder joint reliability assessment. |
| Starting Page | 572 |
| Ending Page | 576 |
| File Size | 1224349 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781424446582 |
| DOI | 10.1109/ICEPT.2009.5270686 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2009-08-10 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Soldering Temperature Environmentally friendly manufacturing techniques Lead Life testing Fatigue Electronics packaging US Department of Energy Life estimation Assembly |
| Content Type | Text |
| Resource Type | Article |
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