NDLI: Effects of the matrix shrinkage and filler hardness on the thermal conductivity of TCA

Content Provider	IEEE Xplore Digital Library
Author	Cong Yue Yan Zhang Zhili Hu Johan Liu Zhaonian Cheng
Copyright Year	2009
Description	Author affiliation: Key Laboratory of Advanced Display and System Applications, Ministry of Education, SMIT Center School of Mechatronics Engineering and Automation, Shanghai University, P. O. B. 282, Shanghai 200072, China (Cong Yue; Yan Zhang; Zhili Hu; Johan Liu; Zhaonian Cheng)
Abstract	Thermal conductive adhesives (TCA) have been widely used as the thermal interface material (TIM). The TCA are usually epoxy or silicone based mixtures containing fillers. The epoxy in TCA also applies a pressure on the filler particles as it shrinks during the curing process. This pressure leads to an increase in the contact area between the filler particles and thus improves the thermal conductivity. In our attempt to discover the effect of filler modulus on the contact areas between two particles we constructed a cell model assay. In order to study the different epoxy characteristics, 28 cases were simulated with different mixtures of epoxy and filler. The thermal conductivity of each case was calculated by FEM. When the shrinkage was higher than 1%, TCA with a filler modulus of 83Gpa (silver) has the largest contact area, which suggests silver has the best TCA performance among the studied materials. Furthermore the viscoelasticity of the epoxy was simulated to evaluate the fully relax time of epoxy and the effect on the thermal conductivity of TCA.
Starting Page	851
Ending Page	855
File Size	605039
Page Count	5
File Format	PDF
ISBN	9781424446582
DOI	10.1109/ICEPT.2009.5270540
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-08-10
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Thermal conductivity Silver Conductive adhesives Conducting materials Curing Phase change materials Thermal engineering Heat transfer Electrons Temperature
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in