NDLI: Microstructure changes and compound growth dynamic at lead-free/Cu interface under different conditions

Content Provider	IEEE Xplore Digital Library
Author	Lihua Qi Jihua Huang Jing Niu Long Yang Yaorong Feng Xingke Zhao Hua Zhang
Copyright Year	2009
Description	Author affiliation: Tubular Goods Research Center of CNPC (Jing Niu; Long Yang; Yaorong Feng) \|\| School of Material Science and Technology, University of Science and Technology Beijing (Lihua Qi; Jihua Huang; Xingke Zhao; Hua Zhang)
Abstract	The atom diffusion and growth behavior of intermetallic compound (IMC) at Sn3.5Ag0.5Cu/Cu interfaces under isothermal aging and thermal-shearing cycling conditions were investigated. The results show that the morphology of Cu6Sn5 IMCs formed at Sn3.5Ag0.5Cu/Cu interface changed gradually from scallop-like to chunk-like, and IMCs thickness developed with the isothermal aging and thermal-shearing cycling times increasing. Furthermore, Cu6Sn5 IMC growth rate under the thermal-shearing cycling condition was higher than that of under isothermal aging. Compared to isothermal aging condition, only one Cu6Sn5 layer was formed and developed at the interface between SnAgCu solder and Cu substrate after 720 cycles. IMC growth dynamic equation is Y = $Kε√D^{ε}Cut$ + $Kη√D^{η}Cut$ with Kη is about $10^{−5}μm^{2}/s$ under isothermal aging, and that is Y = y0 + $Kη√D^{η}Cut$ under the thermal-shearing cycling condition with dynamic parameter Kη = $√2(C^{η/ε}η$ − $C^{η/β}η)^{½}÷(C^{η/β}η$ − $C^{β/η}β)^{½}$ is about $10^{−5}$ to $10^{−4}μm^{2}/s.$
Starting Page	1083
Ending Page	1087
File Size	4109568
Page Count	5
File Format	PDF
ISBN	9781424446582
DOI	10.1109/ICEPT.2009.5270590
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-08-10
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Microstructure Environmentally friendly manufacturing techniques Time of arrival estimation Isothermal processes Aging Tin Lead Intermetallic Morphology Equations
Content Type	Text
Resource Type	Article

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