NDLI: A method of reliability assessment on creep corrosion for immersion silver finished PCBs

Content Provider	IEEE Xplore Digital Library
Author	Shunong Zhang Rui Kang Shivastava, A. Osterman, M. Pecht, M.
Copyright Year	2009
Description	Author affiliation: Department of System Engineering Beihang University Beijing, 100191, China (Shunong Zhang; Rui Kang) \|\| Center for Advanced Life Cycle Engineering (CALCE) Department of Mechanical Engineering University of Maryland, College Park, MD 20742, USA (Shivastava, A.; Osterman, M.) \|\| Center for Advanced Life Cycle Engineering (CALCE) Department of Mechanical Engineering University of Maryland, College Park, MD 20742, USA Dept. of Electronic Engineering, City University of Hong Kong (Pecht, M.)
Abstract	This study focuses on a method of reliability assessment for creep corrosion on immersion silver-finished PCBs utilizing the mixed flow gas (MFG) test and clay test. Four kinds of locations were defined to conveniently describe the location from which the dendrite corrosion products were growing: IL refers to the location that corrosion products grew from a hole or pad edge with solder mask; IIL refers to the location that corrosion products grew from a hole or pad edge without solder mask; IIIL refers to the location that corrosion products grew on a hole or pad; and IVL refers to the location that corrosion products grew from solder mask. The IL dendrite corrosion product is a key factor to result in a short circuit. It is better to use the maximum length of the IL dendrite corrosion products as an assessment parameter. The failure criterion can be the distance (or half the distance) between the edges of two holes (or pads) or from one hole to another pad. The regression equation of the maximum length of the IL dendrite corrosion products and time can be used to predict remaining life. IVL dendrite corrosion products are potentially dangerous to result in a short circuit. The growth rate of corrosion products, which refers to the length that the corrosion products grow per unit of time, can also be an assessment parameter to describe the growth features of corrosion products. The thickness gain of copper for monitoring corrosion rate can be measured by cross-section method. Two cases show that the thickness gains conform to lognormal distribution.
Starting Page	1217
Ending Page	1225
File Size	3668555
Page Count	9
File Format	PDF
ISBN	9781424449033
DOI	10.1109/ICRMS.2009.5270039
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-07-20
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Creep Circuits creep corrosion immersion silver Equations PCB Thickness measurement reliability assessment Silver mixed flow gas (MFG) Corrosion Gain measurement Copper Monitoring Testing
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in