NDLI: Failure analysis of halide of epoxy molding compound used for electronic packing

Content Provider	IEEE Xplore Digital Library
Author	Jianhai Ye Shengxiang Bao Lili Ma Dechun Lv
Copyright Year	2009
Description	Author affiliation: State Key Laboratory of Electronic Thin Films and Integrated Devices University of Electronic Science and Technology of China, Chengdu, 610054, China (Jianhai Ye; Shengxiang Bao; Lili Ma; Dechun Lv)
Abstract	As the continuously development of microelectronics industry, higher demand has been put forward toward the electronic packing technology. Being one of the three most important packaging materials (lead frame, spun gold, Epoxy Molding Compound) used for semiconductor, EMC has directly affected the performance of the semiconductor product. In this article, the transistor (model SOT32) was researched. Obtaining the packaging EMC of the transistor through the chemistry method, the elemental compositions of the EMC were analyzed by the scanning electron microscope (SEM) and the energy dispersive spectrum analysis (EDS). On discussing the differences in the microstructure and the elemental compositions between the failure and the qualified samples, the failure mechanism of the electronic components which was because of the halide of the EMC was lodged and the corresponding improve measures were discussed.
Starting Page	759
Ending Page	762
File Size	728652
Page Count	4
File Format	PDF
ISBN	9781424446582
DOI	10.1109/ICEPT.2009.5270648
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-08-10
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Failure analysis Electromagnetic compatibility Electronics packaging Semiconductor device packaging Chemical elements Scanning electron microscopy Microelectronics Electronics industry Industrial electronics Chemical technology
Content Type	Text
Resource Type	Article

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