NDLI: Enhancement of fast-flow underfill performance by use of silane additives

Content Provider	IEEE Xplore Digital Library
Author	Vincent, M.B. Wong, C.P.
Copyright Year	1998
Description	Author affiliation: Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA (Vincent, M.B.)
Abstract	A challenge in flip-chip technology development is to improve the thermo-mechanical reliability of the flip-chip assembly. To increase reliability, an underfill encapsulant is applied to the gap between die and substrate to provide thermal-mechanical protection as well as environmental protection to the assembly. The fast-flow method is currently the most widely used method for applying the underfill to the gap. This method dispenses the underfill along one or two sides of the die and allows the underfill to fill the gap by capillary flow. There are two major opportunities for improvement of the fast-flow method of underfilling: flow time and cure time. This paper presents work on enhancement of the underfill viscosity and wetting properties by silane coupling agents to decrease the time to underfill the die. Viscosity, contact angle measurements, and flow time in a simulated flip-chip are used to test the effects of the additives in the underfill.
Starting Page	16
Ending Page	20
File Size	535815
Page Count	5
File Format	PDF
ISBN	0780347951
DOI	10.1109/ISAPM.1998.664427
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1998-03-18
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Assembly Thermal stresses Protection Viscosity Thermomechanical processes Surface tension Equations Packaging Surface contamination Costs
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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