NDLI: Reliability Modeling and Assessment of Embedded Capacitors in Organic Substrates

Content Provider	IEEE Xplore Digital Library
Author	Lee, K.J. Damani, M. Pucha, R.V. Bhattacharya, S.K. Tummala, R.R. Sitaraman, S.K.
Copyright Year	1999
Abstract	Understanding and quantifying the RLC characteristics of the embedded passives under thermomechanical deformation during fabrication and accelerated thermal conditions is necessary for their successful implementation. Embedded passives are composite layers with dissimilar material properties compared to the neighboring layers in the integral substrate. The ongoing project explores the fabrication, multifield physics-based reliability modeling and accelerated testing of embedded passive test vehicles. As a first step, in this paper, the effect of thermomechanical deformation on the electrical characteristics of embedded capacitors is studied at frequencies from 100 KHz to 2 GHz using two test vehicles. Test vehicles with embedded passives were fabricated and were subjected to accelerated thermal cycles between -55degC to 125degC, between -40degC to 125degC and high humidity and temperature conditions of 85degC/85% RH. Significant changes in the electrical parameters of the embedded capacitors are observed. The fabrication process mechanics with multiphysics global-local modeling methodology is demonstrated to study the effect of thermal cycling on the electrical characteristics of embedded capacitors. The results obtained from the multiphysics global-local modeling methodology are validated against the measured electrical characteristics of the fabricated functional test boards. The effect of changes in electrical parameters of embedded passives on system performance of low-pass filters is presented
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society
Starting Page	152
Ending Page	162
Page Count	11
File Size	1845131
File Format	PDF
ISSN	15213331
Volume Number	30
Issue Number	1
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-03-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Capacitors Testing Fabrication Vehicles Electric variables Thermomechanical processes Life estimation Acceleration Material properties Frequency thermomechanical deformation Embedded passives finite element analysis (FEA) humidity testing reliability thermal cycling
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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