NDLI: Novel process warpage modeling of matrix stacked-die BGA

Content Provider	IEEE Xplore Digital Library
Author	Xueren Zhang Tong Yan Tee Jiang Zhou
Copyright Year	1999
Abstract	A comprehensive warpage analysis is performed on the matrix stacked-die ball grid array BGA (SDBGA) by means of finite-element modeling and experimental warpage measurements. By comparing the block warpage results from conventional linear small deformation simulation and the experimental measurement results, it is found that the linear method is not able to capture the warpage behavior of the SDBGA matrix, because the change of the centroidal moment of inertia of cross section after deformation cannot be considered due to small deformation assumption. The nonlinear large deformation analysis must be taken instead. Based on the nonlinear analysis, an advanced warpage prediction methodology for matrix SDBGA is established. This methodology is then used to characterize the warpage behavior of matrix SDBGA and to study the different effects on the warpage. Warpage of matrix SDBGA during the whole assembly processes is also predicted. For the SDBGA matrix investigated, the crossbow dominant warpage and buckling phenomena are observed for the matrix after bottom die bonding and after interposer bonding, which are new findings in the warpage study for electronic packages. It is also found that not only the total die length, but also the dice distribution will affect the warpage pattern of the matrix. For the matrix after top die bonding and after molding, normal warpage patterns are observed, i.e., both crossbow and coilset warpage are comparable. "Bending interaction" and the "warpage competition" mechanisms are proposed to explain the warpage characteristic for matrix SDBGA.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society IEEE Components, Packaging and Manufacturing Technology Society
Starting Page	232
Ending Page	239
Page Count	8
File Size	894014
File Format	PDF
ISSN	15213323
Volume Number	29
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-05-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electronics packaging Chip scale packaging Microassembly Assembly Manufacturing Strips Finite element methods Bonding Stacking Performance analysis stacked die Finite-element modeling matrix ball grid array (BGA) process warpage
Content Type	Text
Resource Type	Article
Subject	Electrical and Electronic Engineering

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