NDLI: Flip-chip BGA assembly process and reliability improvements

Content Provider	IEEE Xplore Digital Library
Author	Thompson, P. Koehler, C. Petras, M. Solis, C.
Copyright Year	1996
Description	Author affiliation: Adv. Interconnect Syst. Lab., Motorola Inc., USA (Thompson, P.)
Abstract	Chip scale packages (CSP) are entering large-scale production in applications such as portable computers and consumer products. In such applications, size and weight reduction is a key goal. However, because the bulk of present and near-term CSP applications are cost-sensitive, these size and weight reductions can not come at a premium cost. The CSP producer is faced with a multi-faceted challenge. State-of-the-art process, equipment and materials are required to build these packages, but little to no price increase is acceptable. By their nature, CSPs contain minimal material to provide mechanical and environmental protection to the semiconductor die, yet no reliability performance relief is granted to CSPs. In this paper, the efforts to meet the CSP metrics of low size and weight, low cost, and high reliability for a flip-chip BGA package (the SLICC, or Slightly Larger than IC Carrier) are presented. For this package, the key challenge was to improve reliability from the then-present unacceptable level to meet Motorola package reliability requirements, without causing an unacceptable penalty in cost or manufacturability. The package construction and assembly are reviewed. Project success metrics are presented. The rational, planning, execution and analysis of a series of designed experiment performed to improve manufacturability and/or reliability are explained. The success of efforts in meeting cost and manufacturability metrics while exceeding reliability metrics is described.
Starting Page	84
Ending Page	90
File Size	704825
Page Count	7
File Format	PDF
ISBN	0780336429
ISSN	10898190
DOI	10.1109/IEMT.1996.559690
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1996-10-14
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Assembly Chip scale packaging Costs Application software Semiconductor device packaging Manufacturing Semiconductor materials Large-scale systems Production Portable computers
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electrical and Electronic Engineering

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