NDLI: Thermal fatigue modelling for SnAgCu and SnPb solder joints

Content Provider	IEEE Xplore Digital Library
Author	Dudek, R. Walter, H. Doering, R. Michel, B.
Copyright Year	2004
Description	Author affiliation: Fraunhofer Inst. Reliability & Microintegration, Berlin, Germany (Dudek, R.; Walter, H.; Doering, R.; Michel, B.)
Abstract	Thermal fatigue of solder joints is investigated by means of the finite element method (FEM). During the usual thermal cycle regime with relatively slow temperature ramping rates, solder constitutive response is dominated by secondary creep. In the paper secondary creep laws are given for SnPb and SnAgCu solders, based on our own measurements and literature data. These secondary creep behaviours are compared to other data recently published. Additional primary creep terms are introduced in the creep description. To relate calculation results to fatigue life, criteria of Manson-Coffin type are proposed. These empirical laws are based on either the cyclic inelastic strain or dissipated energy. Effects of the choice of different creep laws on the calculated creep strains and energy densities are studied for two standard components on FR-4 board, a ceramic chip resistor (CC) of size 0805 and a plastic ball grid array with 225 I/O (PBGA 225). It is shown that the choice of the creep law, e.g. the inclusion of primary creep, does significantly affect only the results for the PBGA solder balls.
Sponsorship	IEEE-CPMT
Starting Page	557
Ending Page	564
File Size	793758
Page Count	8
File Format	PDF
ISBN	0780384202
DOI	10.1109/ESIME.2004.1304091
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2004-05-10
Publisher Place	Belgium
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Fatigue Soldering Creep Capacitive sensors Finite element methods Temperature Ceramics Resistors Plastics Electronics packaging
Content Type	Text
Resource Type	Article

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