NDLI: Hygro-thermal Finite Element Analysis of Green Stacked Die Package

Content Provider	IEEE Xplore Digital Library
Author	Hua, Z.K. Li, C.Y. Zhang, J.H. Luo, Y.X. Cao, L.Q.
Copyright Year	2007
Description	Author affiliation: Sch. of Mech. & Electron. Eng., Autom. Shanghai Univ., Shanghai (Hua, Z.K.; Li, C.Y.; Zhang, J.H.)
Abstract	3D stacked die packages are especially common today. With thinner chip and multi-layer, it requires higher reliability of such a package design. Besides this, with the increasing rigid requirements for prohibiting lead (Pb) and also the trend of green electronics, higher reflow temperature is required. All mentioned above pose a challenge towards the development of the stacked die package. And in this paper, the author presents a hygrothermal and analysis of a 4-layer stacked die package, with emphasis on the thermal induced stress and moisture diffusion characteristic. First, according to the JEDEC standard, the moisture diffusion characteristic under different conditions is investigated. Second, the thermal induced stress during reflow time is studied. Results show that the substrate and bottom adhesive endure large thermal stress and strain while have higher moisture diffusion rate. Both of the hazards will reduce the capability of the whole device, even cause the 'popcorn' cracking. Such results also indicate why the reliability of the bottom layers is relatively low in manufacture.
Starting Page	86
Ending Page	91
File Size	3462993
Page Count	6
File Format	PDF
ISBN	9781424413355
ISSN	10898190
DOI	10.1109/IEMT.2007.4417057
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-10-03
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Finite element methods Thermal stresses Electronic packaging thermal management Electronics packaging Moisture Lead Temperature Capacitive sensors Hazards Manufacturing
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electrical and Electronic Engineering

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