NDLI: Reliability of Lead-Free Solder Interconnections in Thermal and Power Cycling Tests

Content Provider	IEEE Xplore Digital Library
Author	Jue Li Karppinen, J. Laurila, T. Kivilahti, J.K.
Copyright Year	1999
Abstract	Lead-free solder interconnection reliability of thin fine-pitch ball grid array (BGA) lead-free packages has been studied experimentally as well as with finite-element (FE) simulations. The reliability tests were composed of the thermal shock test, the local thermal cycling test (resistors embedded in the board around the package), and the power cycling test (heat generation in the die). A 3-D board-level finite-element analysis (FEA) with local models was carried out to estimate the reliability of the solder interconnections under various test conditions. Due to the transient nature of the local thermal cycling test and the power cycling test, a sequential thermal-structural coupling analysis was employed to simulate the transient temperature distribution as well as the mechanical responses. Darveaux's approach was used to predict the life time of the solder interconnections. Furthermore, the numerical results validated by the experimental results indicated that the diagonal solder interconnections beneath the die edge were the most critical ones of all the tests studied here. It has been found that the fatigue life in the power cycling test was much longer than that in the other two tests. Detailed discussions about the failure mechanism of solder interconnections as well as the microstructural observations of the primary cracks are reported in this paper.
Sponsorship	IEEE Components, Packaging, and Manufacturing Technology Society
Starting Page	302
Ending Page	308
Page Count	7
File Size	1326990
File Format	PDF
ISSN	15213331
Volume Number	32
Issue Number	2
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2009-06-01
Publisher Place	U.S.A.
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Environmentally friendly manufacturing techniques Lead Finite element methods Thermal resistance Transient analysis Sequential analysis Life testing Electronics packaging Iron Electric shock thermal shock test Finite-element method (FEM lead free power cycling test reliability solder joint
Content Type	Text
Resource Type	Article
Subject	Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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