NDLI: Fatigue Test Method for Observing the Delamination Effect in a QFN Package

Content Provider	IEEE Xplore Digital Library
Author	Abdullah, S. Abdullah, M.F. Arifin, A.K.
Copyright Year	2007
Description	Author affiliation: Univ. Kebangsaan Malaysia, Bangi (Abdullah, S.; Abdullah, M.F.; Arifin, A.K.)
Abstract	Semiconductor devices are assembled in a variety of package configurations, and are they used in various applications. The quad flat no lead (QFN) package is useful for improving the reliability of the package. Generally, thermal cycle tests (TCTs) are applied to under development electronic packages in order to prove their reliability. At the early stage, however, a more effective test is desirable because of the TCTs are time-consuming. A new mechanical fatigue test for the QFN package, namely the three-point assembly fixture with a rounded contact surface test method, was proposed and it is the subject of this paper. This fixture test method is a test assembly that supports a specimen on two anvils or rollers, and symmetrically loads the specimen on the opposite surface with an anvil or roller using micro tester; a micro tensile tester incorporating a deflection measuring device shall be used to generate a controlled board deflection rate. The validity of the mechanical test method can then be verified based on the stress analysis results and also these obtain in the experiments. Considering the QFN package delamination, lead cracking, package body cracking, and cracking between the various lead statistically based on the experimental, it was shown that the probability during cycle loads and the maximum load for the QFN package for delamination can be estimated.
Starting Page	670
Ending Page	674
File Size	617661
Page Count	5
File Format	PDF
ISBN	9781424413249
DOI	10.1109/EPTC.2007.4469711
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-12-10
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Fatigue Delamination Electronic packaging thermal management Semiconductor device packaging Assembly Fixtures Semiconductor devices Electronic equipment testing Tensile stress Probability delamination QFN package thermal cycle fatigue test stress analysis
Content Type	Text
Resource Type	Article

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