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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Doany, F.E. Schow, C.L. Lee, B.G. Budd, R. Baks, C. Dangel, R. John, R. Libsch, F. Kash, J.A. Chan, B. How Lin Carver, C. Jianzhuang Huang Berry, J. Bajkowski, D. |
| Copyright Year | 2011 |
| Description | Author affiliation: Endicott InterConnect Technologies, 1093 Clark Street, Endicott, NY 13760 (Chan, B.; How Lin; Carver, C.; Jianzhuang Huang; Berry, J.; Bajkowski, D.) || IBM - T. J. Watson Research Center, 1101 Kitchawan Road, Yorktown Heights, NY 10598 (Doany, F.E.; Schow, C.L.; Lee, B.G.; Budd, R.; Baks, C.; Dangel, R.; John, R.; Libsch, F.; Kash, J.A.) |
| Abstract | We report here on the design, fabrication and characterization of an integrated optical data bus designed for terabit/sec-class module-to-module on-board data transfer using integrated optical transceivers. The parallel optical transceiver is based on a through-silicon-via (TSV) silicon carrier as the platform for integration of 24-channel VCSEL and photodiode arrays with CMOS ICs. The Si carrier also includes optical vias (holes) for optical access to conventional surface-emitting 850-nm optoelectronic (OE) devices. The 48-channel transceiver is flip-chip soldered to an organic carrier forming the transceiver Optomodule. The optical printed circuit board (o-PCB) is a typical FR4 board with a polymer waveguide layer added on top. A 48-channel flex-waveguide is fabricated separately and attached to the FR4 board. Turning mirrors are fabricated into the waveguides and a lens array is attached to facilitate optical coupling. An assembly procedure has been developed to surface mount the Optomodule to the o-PCB using a ball grid array (BGA) process which provides both electrical and optical interconnections. Efficient optical coupling is achieved using a dual-lens optical system, with one lens array incorporated into the Optomodule and a second on the o-PCB. Fully functional Optomodules with 24 transmitter + 24 receiver channels were characterized with transmitters operating up to 20 Gb/s and receivers up to 15 Gb/s. Finally, two Optomodules were assembled onto an o-PCB and a full optical link demonstrated, achieving > 20 bidirectional links at 10 Gb/s. At 15 Gb/s, error-free operation was demonstrated for 15 channels in each direction, realizing a record o-PCB link with a 225 Gb/s bidirectional aggregate data rate. |
| Starting Page | 790 |
| Ending Page | 797 |
| File Size | 4890743 |
| Page Count | 8 |
| File Format | |
| ISBN | 9781612844978 |
| ISSN | 05695503 |
| e-ISBN | 9781612844985 |
| e-ISBN | 9781612844961 |
| DOI | 10.1109/ECTC.2011.5898601 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2011-05-31 |
| Publisher Place | Florida, USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Optical waveguides Optical device fabrication Optical receivers High speed optical techniques Integrated optics Optical transmitters Optical interconnections |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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