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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Hau-Riege, C. Zang, R. You-Wen Yau Yadav, P. Keser, B. Jong-Kai Lin |
| Copyright Year | 2011 |
| Description | Author affiliation: Qualcomm, 5775 Morehouse Drive, San Diego, CA 92121 (Zang, R.; You-Wen Yau; Yadav, P.; Keser, B.) || Qualcomm, 3165 Kifer Road, Santa Clara, CA 95051 (Hau-Riege, C.; Jong-Kai Lin) |
| Abstract | Electromigration experiments have been conducted on lead-free solder balls in wafer-level packages (WLP). Lifetime distribution, Joule heating, failure mode, and the effect of current-direction are discussed. In addition, these results are compared with similar BGA interconnects in packages surface-mounted to boards as well as lead-free flip-chip bumps. It is concluded that the interconnects of this study are robust for electromigration reliability owing to its under bump metallurgy (UBM) and size. |
| Starting Page | 717 |
| Ending Page | 721 |
| File Size | 1242550 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781612844978 |
| ISSN | 05695503 |
| e-ISBN | 9781612844985 |
| e-ISBN | 9781612844961 |
| DOI | 10.1109/ECTC.2011.5898592 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2011-05-31 |
| Publisher Place | Florida, USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Electromigration Heating Copper Reliability Current density Nickel Integrated circuit interconnections |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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